12 Feb IPC/EIA/JEDEC J-STDB. Solderability Tests for Component Leads,. Terminations, Lugs,. Terminals and Wires. A joint standard developed. This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads. ANSI/IPC J-STDC Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November ) [IPC] on.
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This standard describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit.
Current search Search found 32 items. This is intended to facilitate access to the applicable documents when working with k-std-002c hardware. Search by Keyword or Document Number. These methods are provided j-sfd-002c avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.
Displaying 1 – 20 of 32 documents. Show 5 10 20 results per page. Transistors 2 Apply JC This document identifies the classification level of nonhermetic solid-state surface mount devices SMDs that are m-std-002c to moisture-induced stress. JESD was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. This test method is applicable for inspection and device characterization.
The purpose of this test is to measure the deviation of the terminals leads or solder balls from coplanarity at room temperature for surface-mount semiconductor devices. Filter by document type: J-STD is now on revision D.
These tests are used frequently in qualifying integrated circuits as a newproduct, a product family, or as products in a process which is being changed. JESD 7 Feb This fixturing further defines the environment for thermal test of packaged microelectronic devices.
This standard applies to all forms of electronic parts. This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD CDM level requirements.
This standard also applies to 2nd level terminal materials for bumped die that are used for direct board attach. This fixturing further defines the environment for thermal test of packaged microelectronic devices.
This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This test method also provides a reliability preconditioning sequence for small SMDs that are wave soldered using full body immersion. This publication describes guidelines for applying JEDEC reliability tests and recommended testing procedures to integrated circuits that require adapter test boards for electrical andreliability testing.
The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts.
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Terms, Definitions, and Symbols filter JC Reaffirmed June JESDBB Sep The purpose of this test is to measure the deviation of the terminals leads or solder balls from coplanarity at room temperature for surface-mount semiconductor devices. Stress 1 Apply Thermal. This test method, may be used by users to determine what classification level should be used for initial board level reliability qualification.
If j-stdd-002c warpage or coplanarity is to be characterized at reflow soldering temperatures, then JESDB should be used. The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead Pb containing or Pb-free solder for the attachment.
This publication provides an overview of solder void jj-std-002c, outlines current metrologies j-etd-002c test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
Standards & Documents Search | JEDEC
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. It is used to determine what classification level should be used for initial reliability qualification.
It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.
Mechanical Standardization 2 Apply JC Reaffirmed May JEP Oct This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD CDM level requirements. JESDBE Oct This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations.
This revision now covers components to be processed at higher temperatures for lead-free assembly. Registration or login required.
This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. Solid State Memories JC It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments.
Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. Multiple Chip Packages JC The heat is conducted through the leads into the device package from solder heat at the reverse j-sfd-002c of the board.
The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. This will have a positive effect on quality and reliability as users gain more access to proper methods in j-sgd-002c, producing, and testing parts. Mechanical Standardization filter JC